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DATA SHEET
SKY77154 System Smart(R) PA Module for CDMA / AMPS (824-849 MHz)
Applications
* Digital cellular (CDMA) * Analog cellular (AMPS) * Wireless local loop (WLL)
Description
The SKY77154 System Smart(R) Power Amplifier Module (PAM) is a fully matched, 8-pin surface mount module developed for Code Division Multiple Access (CDMA) / Advanced Mobile Phone Service (AMPS) and Wireless Local Loop (WLL) applications. This small and efficient module packs a full 824- 849 MHz bandwidth coverage into a single compact package. The device meets the stringent IS95 CDMA linearity requirements to and exceeding 28 dBm output power, and can be driven to levels beyond 31 dBm for high efficiency in FM mode operation. A low current pin (VCONT) provides improved efficiency for the low RF power range of operation. The single Gallium Arsenide (GaAs) Microwave Monolithic Integrated Circuit (MMIC) contains all active circuitry in the module. The MMIC contains on-board bias circuitry, as well as input and interstage matching circuits. The output match is realized off-chip and within the module package to optimize efficiency and power performance into a 50-ohm load. This device is manufactured with Skyworks' GaAs Heterojunction Bipolar Transistor (HBT) process that provides for all positive voltage DC supply operation while maintaining high efficiency and good linearity. Primary bias to the SKY77154 is supplied directly from a three-cell Ni-Cd, a single-cell Li-Ion, or other suitable battery with an output in the 3.2 to 4.2 volt range. Power down is accomplished by setting the voltage on the low current reference pin to zero volts. No external supply side switch is needed as typical "off" leakage is a few microamperes with full primary voltage supplied from the battery.
Features
* Low voltage positive bias supply - 3.2 V to 4.2 V * Low VREF - 2.85 V, nominal * Low IREF - less than 1 mA * Good linearity * High efficiency * Large dynamic range * 8-pin package - 3 x 3 x 1.2 mm * Power down control * Dynamic bias control * InGaP * IS95/CDMA2000/EVDO
MODULE
VCONT (3)
MMIC
Driver Stage Bias Power Stage Bias
Skyworks offers lead (Pb)-free "environmentally friendly" packaging that is RoHS compliant (European Parliament for the Restriction of Hazardous Substances).
VREF (4)
VCC1 (1) VCC2 (8) RF_IN (2) GND (5, 6)
Input Match
DA
Inter-Stage Match
PA
Output Match
(7) RF_OUT
103067_001
Figure 1. Functional Block Diagram
Skyworks Solutions, Inc. * Phone [781] 376-3000 * Fax [781] 376-3100 * sales@skyworksinc.com * www.skyworksinc.com
103067A * Skyworks Proprietary and Confidential information. * Products and product information are subject to change without notice. * November 3, 2006
1
DATA SHEET * SKY77154
SYSTEM SMART(R) PAM FOR CDMA / AMPS (824-849 MHZ)
Electrical Specifications
The following tables list the electrical characteristics of the SKY77154 Power Amplifier. Table 1 lists the absolute maximum ratings, while Table 2 lists the recommended operating conditions for achieving the electrical performance listed in Table 4. Table 3 presents a truth table for the power settings.
Table 1. Absolute Maximum Ratings 1
Parameter RF Input Power Supply Voltage Reference Voltage Control Voltage Case Temperature 2 Operating Storage CDMA AMPS Symbol PIN_D PIN_A VCC VREF VCONT TCASE TSTG Minimum -- -- -- -- -- -30 -55 Nominal -1.0 3.0 3.4 2.85 TBD 25 -- Maximum 8.0 8.0 6.0 3.0 3.0 +110 +125 Volts Volts Volts C Unit dBm
1 No damage assuming only one parameter is set at limit at a time with all other parameters set at nominal value. 2 Case Operating Temperature refers to the temperature of the GROUND PAD at the underside of the package.
Table 2. Recommended Operating Conditions
Parameter Output Power Operating Frequency Supply Voltage Reference Voltage Control voltage Case Operating Temperature CDMA AMPS Symbol PO_D PO_A FO VCC VREF VCONT TO Minimum -- -- 824.0 3.2 2.75 1.0 -30 Nominal -- -- 836.5 3.4 2.85 TBD +25 Maximum 28 31 849.0 4.2 2.95 2.0 +85 MHz Volts Volts Volts C Unit dBm
Table 3. Power Range Truth Table 1
Power Setting High Power Low Power Shut Down
1
VREF 2.85 V 2.85 V 0.0 V
VCONT 2.0 V < 1.3 V 0.0 V
Output Power 28 dBm 0 dBm --
In the output power range between -10 dBm and +28 dBm, VCONT can be continuously adjusted to minimize current consumption while meeting required linearity specification.
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November 3, 2006 * Skyworks Proprietary and Confidential information. * Products and product information are subject to change without notice. * 103067A
SYSTEM SMART(R) PAM FOR CDMA / AMPS (824-849 MHZ)
DATA SHEET * SKY77154
Table 4. Electrical Specifications for CDMA AMPS Nominal Operating Conditions 1
Characteristics Symbol GLOW Digital Mode Gain Conditions GHIGH Analog Mode Gain Flatness 2 GP GF PAED_LOW Digital Mode Power Added Efficiency Analog Mode PAED_HIGH PAEa ICC_LOW Total Supply Current ICC_HIGH Quiescent Current Reference Current Control Current ICQ_LOW ICQ_HIGH IREF ICTRL ACP1LOW 885 kHz offset ACP1HIGH Adjacent Channel Power 3,4 ACP2LOW 1.98 MHz offset ACP2HIGH Harmonic Suppression Second Third Noise Power in RX Band 869-894 MHz Noise Figure Input Voltage Standing Wave Ratio Stability (Spurious output) Ruggedness--No damage 5 Turn On Time 6 Turn Off Time 6
1 2 3 4
Condition VCONT 1.3 V PO_D 0 dBm VCONT = 1.55 V PO_D = 16 dBm VCONT = 1.8 V PO_D = 28 dBm VCONT = 2.08 V PO_A = 31 dBm VCONT 2.08 V PO 31 dBm VCONT = 1.3 V PO_D = 0 dBm VCONT = 1.8 V PO_D = 28 dBm VCONT = 1.8 V PO_A = 31 dBm VCONT = 1.3 V PO_D = 0 dBm PO_D = 28 dBm VCONT = 1.3 V VCONT 1.8 V VCONT = 1.8 V VCONT 1.3 v PO_D 0 dBm VCONT 1.8 V PO_D 28 dBm VCONT 1.3 v PO_D 0 dBm VCONT 1.8 V PO_D 28 dBm PO_D 31 dBm PO_D 28 dBm
Minimum 21.5 24.5 28.0 28.0 -- 0.60 37.0 48.0 -- -- 25 55 0.2 100 -- -- -- -- -- -- -- -- -- -- 10:1 5:1 -- -- -- --
Typical 23.0 26.0 29.0 29.0 -- 0.75 39.0 54.0 37 475 35 72 1.0 120 -58 -49 -60 -58 -40 -52 -137 4.6 2.0:1 -- -- -- 40 5 40 5
Maximum 24.5 27.5
Unit
GMID
dB 31.0 31.0 0.75 -- -- -- 50 mA 500 50 95 2.0 150 -50 -48 dBc -56 -56 -30 -45 -136 5.0 2.3:1 -62.0 -- -- -- -- -- -- dBm/Hz dB dBc mA mA A % dB
FO2 FO3 RxBN NF VSWR S Ru
5:1 VSWR all phases PO_D 28 dBm PO_D = 29 dBm
dBc VSWR s s
DC RF DC RF
TONDC TONRF TOFFDC TOFFRF
VCC = 3.4 V, VREF = 2.85 V, Freq. = 836.5 MHz, TCASE = +25 C. Over operating frequency range ACP is specified per IS95 as the ratio of the total in-band power (1.23 MHz BW) to adjacent power in a 30 kHz BW. For CDMA2000 test configured as [PCH @ -3.75 dB, DCCH-9600 bps @ 0 dB; SCHO-9600 bps @ 0 dB] and other test configurations that yield a peak-to-average up to 4.5 dB for CCDF = 1%, up to 1. dB power back off from the maximum listed for IS95 may be required to meet specified maximum ACP performance under worst-case conditions. All phases, time = 10 seconds; VCC = 4.2 V; Freq. = 824 MHz, 836.5 MHz, 849 MHz; TCASE = -30 C, +25 C, +85 C; PO set using 50 load, PIN held constant during mismatch. TONDC is time required to reach stable quiescent bias (10%) after VREF is switched high. TOFFDC is time required for battery to decrease to < 100 A after VREF is switched low. After ICQ is stable, The TONRF is time to reach final output power (1 dB) once RF input is applied. TOFFRF is time required for PO to drop 30 dB once RF input is removed.
5 6
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103067A * Skyworks Proprietary and Confidential information. * Products and product information are subject to change without notice. * November 3, 2006
3
DATA SHEET * SKY77154
SYSTEM SMART(R) PAM FOR CDMA / AMPS (824-849 MHZ)
Characterization Data
Figure 2 through Figure 7 illustrate the characteristics of a typical SKY77154 power amplifier designed for operation in the CDMA frequency band (824-849 MHz). Shown are power sweep characteristics for key performance parameters up to 28 dBm output power.
30 29 28 27
Gain (dB)
26 25 24 23 22 0 2 4 6 8 10 12 14 16 18 20 22 24 26 28
103067_002
POUT (dBm)
Figure 2. Gain vs. VCONT
68
63
ACPR1 (dBc)
58
53
48
43
38 0 2 4 6 8 10 12 14 16 18 20 22 24 26 28
103067_003
POUT (dBm)
Figure 3. ACPR1 vs. VCONT
1.3 V
1.35 V
1.4 V
1.45 V
1.5 V
1.55 V
1.6 V
1.7 V
1.8 V
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November 3, 2006 * Skyworks Proprietary and Confidential information. * Products and product information are subject to change without notice. * 103067A
SYSTEM SMART(R) PAM FOR CDMA / AMPS (824-849 MHZ)
DATA SHEET * SKY77154
80
75
70
ACPR2 (dBc)
65
60
55
50 0 2 4 6 8 10 12 14 16 18 20 22 24 26 28
103067_004
POUT (dBm)
Figure 4. ACPR2 vs. VCONT3
50 48 46
2nd Harmonic (dBc)
44 42 40 38 36 34 32 30 0 2 4 6 8 10 12 14 16 18 20 22 24 26 28
103067_005
POUT (dBm)
Figure 5. 2 x f0 vs. VCONT
1.3 V
1.35 V
1.4 V
1.45 V
1.5 V
1.55 V
1.6 V
1.7 V
1.8 V
Skyworks Solutions, Inc. * Phone [781] 376-3000 * Fax [781] 376-3100 * sales@skyworksinc.com * www.skyworksinc.com
103067A * Skyworks Proprietary and Confidential information. * Products and product information are subject to change without notice. * November 3, 2006
5
DATA SHEET * SKY77154
SYSTEM SMART(R) PAM FOR CDMA / AMPS (824-849 MHZ)
18 16 1.3 V 14 12 1.5 V 1.8 V
PAE (%)
10 8 6 4 2 0 0 2 4 6 8 10 12 14 16 18 20
103067_006
POUT (dBm)
Figure 6. PAE vs. VCONT
42 40 38 36 34 32 1.3 V 1.5 V 1.8 V
PAE (%)
30 28 26 24 22 20 18 16 14 20 22 24 26 28
103067_007
POUT (dBm)
Figure 7. PAE vs. VCONT
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November 3, 2006 * Skyworks Proprietary and Confidential information. * Products and product information are subject to change without notice. * 103067A
SYSTEM SMART(R) PAM FOR CDMA / AMPS (824-849 MHZ)
DATA SHEET * SKY77154
Evaluation Board Description
The evaluation board is a platform for testing and interfacing design circuitry. To accommodate the interface testing of the SKY77154, the evaluation board schematic and evaluation board assembly diagram are included for preliminary analysis and design. Figure 8 shows the basic schematic of the evaluation board for the 824 MHz to 849 MHz range.
VCC1
A C3 330 pF
1
VCC1
VCC2
8 C4 A 330 pF C5 1000 pF C6 10 F
VCC2
RF_IN
2
RF IN
RF OUT
7
RF_OUT
VCONT
C2 1000 pF
3
VCONT
GND
6
VREF
C1 1000 pF
4
VREF
GND
5
A
Place caps at closest proximity to PA module with the capacitor grounds directly connected to the PAM grounds.
103067_008
Figure 8. Evaluation Board Schematic
P1
RF_IN SKYWORKS SOLUTIONS, INC.
C2 C3
1
J1
GND VCONT GND
J2
GND VCC1
C1
U1
VCC2 C4 C5 C6 GND
VREF
EN17-D445-001 REV 00 6/12/03 RF_OUT
COMPONENTS C1 1000 pF C2 1000 pF C3 330 pF C4 330 pF C5 1000 pF C6 10 F
P2
103067_009
Figure 9. Evaluation Board Assembly Diagram
Skyworks Solutions, Inc. * Phone [781] 376-3000 * Fax [781] 376-3100 * sales@skyworksinc.com * www.skyworksinc.com
103067A * Skyworks Proprietary and Confidential information. * Products and product information are subject to change without notice. * November 3, 2006
7
DATA SHEET * SKY77154
SYSTEM SMART(R) PAM FOR CDMA / AMPS (824-849 MHZ)
Package Dimensions and Pin Descriptions
The SKY77154 is a multi-layer laminate base, overmold encapsulated modular package designed for surface mount solder attachment to a printed circuit board. Figure 10 is a mechanical drawing of the pad layout for this package. Figure
METAL PAD EDGE 0.4 0.03 PIN 1 LOCATOR 3 B C
12 shows the pin names and the pin numbering convention, which starts with pin 1 in the upper left and increments counter-clockwise around the package. Figure 13 illustrates typical case markings.
0.4 0.03 METAL PAD EDGES 0.4 0.03 (0.1)
DETAIL
(0.1) 3
A
0.5 0.03 0.4 0.03
SMT PAD SCALE: 2X 2X THIS ROTATION 2X ROTATED 180
DETAIL
B
SMT PAD SCALE: 2X 1X 1X 1X 1X THIS ROTATION ROTATED 180 ROTATED 90 CW ROTATED 90 CCW
0.05 A B C
TOP VIEW
2X 0.7 8X 1.4
PIN 1 ID 0.2 X 0.2
4X 1.2
A
4X 0.4
4X 1.4
2X 1.325
B
8X SMT PAD 0.05 M A B C 0.025 M SOLDER MASK OPENING 0.15 A B C A
A 1.15 0.1 0.1
3X R0.2
SIDE VIEW BOTTOM VIEW
NOTES: Unless otherwise specified 1. DIMENSIONING AND TOLERANCES IN ACCORDANCE WITH ASME Y14.5M-1994. 2. SEE APPLICABLE BONDING DIAGRAM AND DEVICE ASSEMBLY DRAWING FOR DIE AND COMPONENT PLACEMENT. 3. PADS ARE SOLDER MASK DEFINED ON ALL INSIDE EDGES. 4. ALL DIMENSIONS ARE IN MILLIMETERS.
103067_010
Figure 10. SKY77154 Package Dimensional Drawing (All Views)
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November 3, 2006 * Skyworks Proprietary and Confidential information. * Products and product information are subject to change without notice. * 103067A
SYSTEM SMART(R) PAM FOR CDMA / AMPS (824-849 MHZ)
DATA SHEET * SKY77154
0.6
1
0.6
0.9
0.4
0.4 0.6
1.65
0.8 TYP
0.8 TYP
0.2
3.2
Component Outline
Component Outline
3.2
STENCIL APERTURE
TOP VIEW APPROACH 1
STENCIL APERTURE
TOP VIEW APPROACH 2
0.6
Common Ground Pad
Component Outline
Component Outline 0.7
0.4
0.5
0.05 ALL AROUND 0.25
2.55
0.8 TYP
0.8 TYP
0.25 3.2
METALLIZATION
TOP VIEW
Thermal Via Array O0.3 mm on 0.5 mm pitch Additional Vias will improve thermal performance. NOTE: Thermal Vias should be tented and filled with solder mask 30-35 m Cu Plating Recommended.
1.30 3.3
SOLDER MASK OPENING
TOP VIEW
All dimensions are in millimeters.
101752_022
Figure 11. Phone PCB Layout Footprint for 3 x 3 mm, 8-Pin Package - SKY77154
Skyworks Solutions, Inc. * Phone [781] 376-3000 * Fax [781] 376-3100 * sales@skyworksinc.com * www.skyworksinc.com
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9
DATA SHEET * SKY77154
SYSTEM SMART(R) PAM FOR CDMA / AMPS (824-849 MHZ)
(1)
VCC1
1
8
VCC2 (1)
RF_IN
2
7
RF_OUT
details on both attachment techniques, precautions, and handling procedures recommended by Skyworks, please refer to Skyworks Application Note: PCB Design and SMT Assembly/Rework, Document Number 101752. Additional information on standard SMT reflow profiles can also be found in the JEDEC Standard J-STD-020. Production quantities of this product are shipped in the standard tape-and-reel format. For packaging details, refer to Skyworks Application Note: Tape and Reel, Document Number 101568.
VCONT
3
6
GND
VREF
4
GROUND PAD
(2)
5
GND
Electrostatic Discharge Sensitivity
The SKY77154 is a Class 2 device. Figure 14 lists the Electrostatic Discharge (ESD) immunity level for each pin of the SKY77154 product. The numbers in Figure 14 specify the ESD threshold level for each pin where the I-V curve between the pin and ground starts to show degradation. The ESD testing was performed in compliance with MIL-STD-883E Method 3015.7 using the Human Body Model. If ESD damage threshold magnitude is found to consistently exceed 2000 volts on a given pin, this so is indicated. If ESD damage threshold below 2000 volts is measured for either polarity, numbers are indicated that represent worst case values observed in product characterization. Various failure criteria can be utilized when performing ESD testing. Many vendors employ relaxed ESD failure standards, which fail devices only after "the pin fails the electrical specification limits" or "the pin becomes completely nonfunctional". Skyworks employs most stringent criteria and fails devices as soon as the pin begins to show any degradation on a curve tracer.
Pad layout as seen from top view looking through package.
(1) (2)
All supply pins may be connected together at the supply. Package underside is GROUND PAD.
103067_012
Figure 12. SKY77154 Pin Configuration and Pin Names (Top View)
Pin 1 Identifier
Manufacturing Part Number
77154-N
Lot Number Year Manufactured Week Package Sealed
Revision Number
NNNNN.N YYWW MX
Country Code
103067_013
Figure 13. Typical Case Markings
Package and Handling Information
Because of its sensitivity to moisture absorption, this device package is baked and vacuum-packed prior to shipment. Instructions on the shipping container label must be followed regarding exposure to moisture after the container seal is broken, otherwise, problems related to moisture absorption may occur when the part is subjected to high temperature during solder assembly. The SKY77154 is capable of withstanding an MSL3/250 C solder reflow. Care must be taken when attaching this product, whether it is done manually or in a production solder reflow environment. If the part is attached in a reflow oven, the temperature ramp rate should not exceed 3 C per second; maximum temperature should not exceed 250 C. If the part is manually attached, precaution should be taken to insure that the part is not subjected to temperatures exceeding 250 C for more than 10 seconds. For
VCC1 > + 2 kV < - 2 kV RF IN > + 2 kV < - 2 kV VCONT > + 2 kV < - 2 kV
1
8
VCC2 > + 2 kV < - 2 kV RF OUT > + 2 kV < - 2 kV
2
7
3
6
GND
VREF 5 GND 4 GROUND PAD > + 2 kV < - 2 kV Pad layout as seen from top view looking through package.
103067_014
Figure 14. ESD Sensitivity Areas (Top View)
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November 3, 2006 * Skyworks Proprietary and Confidential information. * Products and product information are subject to change without notice. * 103067A
SYSTEM SMART(R) PAM FOR CDMA / AMPS (824-849 MHZ)
DATA SHEET * SKY77154
To avoid ESD damage, both latent and visible, it is very important that the product assembly and test areas follow the Class-1 ESD * Personnel Grounding - Wrist Straps - Conductive Smocks, Gloves and Finger Cots - Antistatic ID Badges * Protective Workstation - Dissipative Table Top - Protective Test Equipment (Properly Grounded) - Grounded Tip Soldering Irons - Solder Conductive Suckers - Static Sensors
handling precautions listed below.
* Facility - Relative Humidity Control and Air Ionizers - Dissipative Floors (less than 109 to GND) * Protective Packaging and Transportation - Bags and Pouches (Faraday Shield) - Protective Tote Boxes (Conductive Static Shielding) - Protective Trays - Grounded Carts - Protective Work Order Holders
Skyworks Solutions, Inc. * Phone [781] 376-3000 * Fax [781] 376-3100 * sales@skyworksinc.com * www.skyworksinc.com
103067A * Skyworks Proprietary and Confidential information. * Products and product information are subject to change without notice. * November 3, 2006
11
Ordering Information
Model Number SKY77154 Manufacturing Part Number SKY77154 Product Revision Package Operating Temperature -30 C to +85 C
Revision History
Revision A Level Date November 3, 2006 Initial Release Description
References
Application Note: PCB Design and SMT Assembly/Rework, Document Number 101752. Application Note: Tape and Reel - RF Modules, Document Number 101568 JEDEC Standard J-STD-020
Copyright (c) 2003-2006, Skyworks Solutions, Inc. All Rights Reserved. Information in this document is provided in connection with Skyworks Solutions, Inc. ("Skyworks") products. These materials are provided by Skyworks as a service to its customers and may be used for informational purposes only by the customer. Skyworks assumes no responsibility for errors or omissions in these materials. Skyworks may make changes to its documentation, products, specifications and product descriptions at any time, without notice. Skyworks makes no commitment to update the information and shall have no responsibility whatsoever for conflicts, incompatibilities, or other difficulties arising from future changes to its documentation, products, specifications and product descriptions. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by or under this document. Except as may be provided in Skyworks Terms and Conditions of Sale for such products, Skyworks assumes no liability whatsoever in association with its documentation, products, specifications and product descriptions. THESE MATERIALS ARE PROVIDED "AS IS" WITHOUT WARRANTY OF ANY KIND, EITHER EXPRESS OR IMPLIED OR OTHERWISE, RELATING TO SALE AND/OR USE OF SKYWORKS PRODUCTS INCLUDING WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, PERFORMANCE, QUALITY OR NON-INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. SKYWORKS FURTHER DOES NOT WARRANT THE ACCURACY OR COMPLETENESS OF THE INFORMATION, TEXT, GRAPHICS OR OTHER ITEMS CONTAINED WITHIN THESE MATERIALS. SKYWORKS SHALL NOT BE LIABLE FOR ANY DAMAGES, INCLUDING SPECIAL, INDIRECT, INCIDENTAL, OR CONSEQUENTIAL DAMAGES, INCLUDING WITHOUT LIMITATION, LOST REVENUES OR LOST PROFITS THAT MAY RESULT FROM THE USE OF THESE MATERIALS WHETHER OR NOT THE RECIPIENT OF MATERIALS HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGE. Skyworks products are not intended for use in medical, lifesaving or life-sustaining applications. Skyworks customers using or selling Skyworks products for use in such applications do so at their own risk and agree to fully indemnify Skyworks for any damages resulting from such improper use or sale. The following are trademarks of Skyworks Solutions, Inc.: Skyworks(R), the Skyworks logo, and Breakthrough Simplicity(R). Product names or services listed in this publication are for identification purposes only, and may be trademarks of Skyworks or other third parties. Third-party brands and names are the property of their respective owners. Additional information, posted at www.skyworksinc.com, is incorporated by reference.

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